Jobs for People with MS: National MS Society

Connecting and Protecting People, Microwave Products Group (MPG) is a leading global provider of mission-critical engineered electronic components and subsystems comprised of five business units in six manufacturing locations. Our brand names are recognized globally including: BSC Filters, York, UK; Dow-Key Microwave, Ventura, CA; Pole/Zero, West Chester, OH; Espy, Austin, TX; and K&L Microwave, Salisbury, Maryland and Dominican Republic. Our expertise is the design and manufacture of communications-based specialty products - engineered components and subsystems - for demanding military, space, commercial aerospace/industrial, and telecom infrastructure applications where function and reliability are crucial. POSITION OVERVIEW: Primarily responsible for the design efforts for electro-mechanical packaging for radio frequency (RF) devices. Position utilizes CAD to design, evaluate, and solve packaging, thermal, and stress challenges related to the assembly of electronic hardware within standard and custom designed enclosures. This position may be located at our West Chester, OH, Salisbury, MD or Columbia, MD facility. Job Duties/Responsibilities: Design high performance mechanical assemblies and support production of designs by production teams Design mechanical structures that house circuit card assemblies, electronic components, subassemblies, etc. Conduct the thermal, mechanical stress, and vibration analysis of electro-mechanical enclosures, heat exchange mechanisms, and printed circuit boards used on airborne, maritime, and ground-mobile RF equipment Conduct air flow calculations to determine mass flow (lb/min), volume flow, velocity, pressure drop, etc., with ambient, inlet, and outlet variables such as temperature, altitude, and pressure Designs and develops PCB's and PCBA's IAW IPC-2221. Produce and maintain the documentation related to the mechanical aspects of a design Develop detail drawings and Bills of Materials (BOM) for assigned product designs Incorporate engineering change orders Support research and investigation to determine the root cause analysis of mechanical failures Support new program proposal efforts including technical interchange with potential customers Support and aid in the development of multiple mechanical designers Knowledge, Skills, and Abilities: Experience in thermal and structural analysis, and electro-mechanical packaging required, NASTRAN is preferred Experience using thermal and stress analysis software is required AutoDesk Inventor and AutoCAD preferred Experience with PCB layout software RF Microwave experience and experience with passive and active circuitry General knowledge of MIL-STD testing is required Knowledge of Airborne Mil environments preferred Knowledge of thermal and mechanical test equipment preferred Knowledge of IPC standards preferred Must have excellent written and verbal skills Must be able to effectively and efficiently communicate with other departments, including manufacturing, quality and management Must be able to communicate effectively with the customer (both internal and external), both in verbal and written formats Requirements: Must be a US Person (US Citizen or permanent resident - green card holder) Bachelor's degree in mechanical engineering from an accredited four-year college or university and 3+ years of relevant experience OR MS in mechanical engineering from an accredited college or university and 2+years of relevant experience Experience with 3D CAD software required Experience with military standards and specifications required Experience with military electro-mechanical enclosure designs highly desired ISO and lean manufacturing experience highly desired Ability to obtain a DoD security clearance